The Analysis Tech Phase 12 Thermal Analyzer is a comprehensive semiconductor thermal tester offering a wide range of steady state and transient thermal measurements for use in production and development environments with powerful features such as:

All Test Modes:

• Testing all devices: diodes, LEDs, bipolar, MOSFET, IGBT, functional IC, thryistors, test dies
• Full 3-terminal and 2-terminal test modes for MOSFETs, IGBTs, bipolars
• Automated high speed data collection, reduction, and analysis for transient and steady state data
• Transient RC models generated directly from measured junction temperature heating/cooling
• Compatible with all 750E Mil Stds and JEDEC 51 Series methods
• Rjc measurement with JEDEC 51-14 transient method
• Transient data plots for all test parameters in all tests modes
• Simple, automated instrument-calibration procedures
• Multiple text and graphics file formats for convenient exporting
• Continuous intelligent monitoring for errors and data validity
• Kelvin (4-wire) connections to eliminate test cable resistances effects
• Selection of automatic power-control by current, wattage, and ΔTj
• Standard and custom test fixturing available

Steady State Thermal Resistance Mode:

•  Multi-junction temperature sensing capability for ICs & multi-die devices
• User-selectable thermal equilibrium criteria
• Batch-mode for determining power level and air flow effects
• Control of accessory laboratory equipment for integrated testing
• Capability for automatically switching the device under test

Die Attach or Power Pulse Mode:

• High speed thermal evaluation with test duration less than 1 second
• Pass/Fail or bin sorting based on die-attach quality
• Data plots of all parameters including die-attach histogram
• Extended-life testing with interspersed die-attach testing
• Interface for mechanized device handlers
• Batch mode die-attachment production testing multi-chip modules

Heating Characterization / Transient Thermal Impedance Mode:

• Heating and cooling curve time-resolution: 1 microsecond
• Heating and cooling curve span: 1 microsecond - 1000 seconds
• Rjc measurement with JEDEC 51-14 dual transient method
• Utilizes structure function analysis, cumulative and differential
• Produces high-order RC models and optimized compact dynamic RC models in Cauer and Foster topologies

Surge Batch Test Mode:

• Selectable Surge Pulse Duration: 5 to 20 milliseconds
• Selectable Surge Pulse Magnitude: 1000 amps max.
• Selectable Number of Surges: 1 to 100
• Selectable Surge Interval: 0 to 1000 seconds
• Selectable Steady State Current Between Surges: 0 to 1000 amps max.

 Comparison of Phase 11 to Phase 12 Thermal Analyzers:

• 1 Megahertz sampling rate versus 333 Kilohertz
• Compatible with all existing Analysis Tech fixturing.
• Enhanced WinTherm Software for Shorter Test Durations
• Improved Signal-to-Noise Ratio
• Self-installation WinTherm CD